Videos

In the first part of this 4-part video series, PI Vice President of Marketing Doug Bailey explains GaN technology and the new possibilities it brings to the power conversion industry.

In the second part of this 4-part video series, PI Vice President of Marketing Doug Bailey breaks down the improved system reliability and robustness realized by GaN technology.

In the third part of this 4-part video series, PI Vice President of Marketing Doug Bailey talks about which applications GaN technology is most suitable for.

In the fourth part of this 4-part video series, PI Vice President of Marketing Doug Bailey introduces PI products available with PowiGaN technology.

During this June 28 panel discussion at PowerUP 2023, Power Integrations technology leaders talk about PowiGaN Technology, why it is superior to discrete GaN technologies and the advantages it offers...

During this June 28 panel discussion at PowerUP 2023, Power Integrations technology leaders talk about PowiGaN Technology, why it is superior to discrete GaN technologies and the advantages it offers...

PI Chairman and CEO Balu Balakrishnan talks about how PowiGaN Technology will soon replace silicon and SiC in realizing the most efficient, most cost-effective high-voltage power supplies.

PI Chairman and CEO Balu Balakrishnan talks about how the company pushes the industry forward with its risk-taking and forward-thinking approach to development.

In this November 30 presentation during Bodo's Wide Bandgap Event 2022, PI's Director of Technical Outreach Andrew Smith explains how to choose among gallium nitride, silicon carbide and traditional silicon...

Heat pumps don't burn fossil fuels and are much more efficient than traditional furnaces. That's why they are quickly becoming the preferred method of home heating around the world. Power...

Senior Product Marketing Manager Edward Ong introduces automotive-qualified Qspeed silicon diodes featuring the industry's lowest Qrr. These 600 V, 12 A diodes can replace SiC components in automotive applications.

HiperLCS Product Demo

The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98%...

Achieving the highest light load efficiency with HiperPFS-3

Achieving the highest light load power factor with HiperPFS-3