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Application Notes

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Description
AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages

These guidelines apply to InSOP packages without bottom exposed pads (such as InSOP-24D). InSOP packages with bottom exposed pads (such as InSOP-24B, InSOP-24C) must be board mounted using IR/convection reflow.

AN-75 - LYTSwitch-6 Family Design Guide

LYTSwitch-6 Family Design Guide

AN-70 - LinkSwitch-TN2 Design Guide

This document describes the design procedure for buck and buck-boost converters using the LinkSwitch-TN2 family of integrated off-line switchers.

AN-65 - LYTSwitch-5 Design Guide
AN-60 - LYTSwitch-0 Design Guide

LYTSwitch-0 Design Guide

AN-59 - LYTSwitch-4 Design Guide
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations

Qspeed Family RoHS Compliant Soldering Considerations

AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers

Reverse Voltage Sharing of Series Rectifiers

AN-301 - Qspeed Reverse Recovery Charge, Current and Time

Reverse Recovery Charge, Current and Time

AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

AN-55 - HiperLCS Family Design Guide

HiperLCS Family Design Guide

AN-39 - LinkSwitch-LP Design Guide LinkSwitch-LP Design Guide