ビデオ | Power Integrations

GaN Explained - Part 2 - GaN's Reliability and Robustness

In the second part of this 4-part video series, PI Vice President of Marketing Doug Bailey breaks down the improved system reliability and robustness realized by GaN technology.

GaN Explained - Part 3 - GaN Applications

In the third part of this 4-part video series, PI Vice President of Marketing Doug Bailey talks about which applications GaN technology is most suitable for.

GaN Explained - Part 4 - PowiGaN Devices

In the fourth part of this 4-part video series, PI Vice President of Marketing Doug Bailey introduces PI products available with PowiGaN technology.

GaN Revolution- Panel Discussion with PI - PowerUP Expo 2023

During this June 28 panel discussion at PowerUP 2023, Power Integrations technology leaders talk about PowiGaN Technology, why it is superior to discrete GaN technologies and the advantages it offers...

GaN 革命 - PowiGaN が GaN の進歩をリード

PI の会長兼 CEO の Balu Balakrishnan 氏が、PowiGaN テクノロジーがまもなくシリコンや SiC に取って代わり、最も効率的でコスト効率の高い高電圧電源を実現する方法について語ります。

GaN 革命 - PowiGaN が電力変換の革新を可能にする

製品開発担当 PI 副社長の Roland Saint-Pierre が、PowiGaN テクノロジーによってこれまでにないレベルの効率と電力密度を備えた電源 IC 設計がどのように可能になったかについて語ります。

GaN 革命 - イノベーションで時代の先を行く

PIの会長兼最高経営責任者（CEO）のBalu Balakrishnan 氏は、同社がリスクを冒し、先進的な開発アプローチでどのように業界を前進させているかについて語ります。

GaN, SiC or Traditional Silicon? Be Technology Agnostic to Get the Best for Your Application - Bodo's Wide Bandgap Event 2022

In this November 30 presentation during Bodo's Wide Bandgap Event 2022, PI's Director of Technical Outreach Andrew Smith explains how to choose among gallium nitride, silicon carbide and traditional silicon...

Heat Pumps with BridgeSwitch - The Future of Domestic Heating

Heat pumps don't burn fossil fuels and are much more efficient than traditional furnaces. That's why they are quickly becoming the preferred method of home heating around the world. Power...

High Performance Diodes for Electric Vehicle Applications

Senior Product Marketing Manager Edward Ong introduces automotive-qualified Qspeed silicon diodes featuring the industry's lowest Qrr. These 600 V, 12 A diodes can replace SiC components in automotive applications.

HiperLCS-2 Chipset Introduction

The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98%...

HiperLCS製品デモ

HiperPFS-3 で、最も高い軽負荷時の力率を達成

HiperPFS-3 で、最も高い軽負荷時の効率を達成

HiperPFS-3 で、最も高い軽負荷時の力率を達成

HiperPFS-5 Product Introduction

The HiperPFS-5 high-efficiency quasi-resonant PFC ICs with 750 V PowiGaN switch enable compact power-factor stage for ultra-fast chargers, consumer electronics, computer and appliance power supplies. Vice President of Marketing Doug...